Photosensitive polyimide application for multi-chip packages.

Application of Photosensitive Polyimide: Mask Saving Process for Buffer Coating

Issues in the LSI polyimide buffer coating process which uses photosensitive polyimide also as a mask of passivation film etching are reviewed. Change of lithography wave length from g-line to i-line causes the difficulty in the polyimide patterning. However, today's improved polymers, both ester type and ionic type, have enough ability to open 10 um windows. Dry etching condition must be adjus...

Photosensitive-polyimide based method for fabricating various neural electrode architectures

An extensive photosensitive-polyimide (PSPI)-based method for designing and fabricating various neural electrode architectures was developed. The method aims to broaden the design flexibility and expand the fabrication capability for neural electrodes to improve the quality of recorded signals and integrate other functions. After characterizing PSPI's properties for micromachining processes, we...

All-copper Chip-to-substrate Interconnections for Flip-chip Packages

saveCHIMP: Application-aware Testbench for Chip Multi-Processors

As computing platforms become more complex, the amount of time and effort spent on verification is increasing at a staggering rate. Despite advanced verification and validation techniques that emerged in recent years, design bugs still manage to escape into tapeout. Thus, there is heavy demand for fast, efficient validation of complex network-on-chip platforms. However, existing test generation...

Physico-chemical Insights on Tuning the Morphology of a Photosensitive Polyimide by UV Laser Irradiation

An aromatic photosensitive polyimide is prepared from 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 4,4'-diaminodiphenyl methane and its structuring ability upon UV-laser exposure is investigated. Surface modification is performed at two laser fluences, i.e. 89 and 244 mJ/cm2, and different number of pulses. The changes of the surface morphology, induced by the employed patterning tech...